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    PI Copper Clad Laminate

    FCCL - PI Copper Clad Laminate

    This series includes various types according to different copper and PI film utilized to meet the specific needs of customers. 


    This series includes various types according to different copper and PI film utilized to meet the specific needs of customers. See usual specifications as follows:

    Base PI film: 0.5 ~ 2.0mils thickness;
    Copper foil: EDHD & RA copper both available1/31/21.0 & 2.0 Oz thicknesses;
    Adhesive: Modified epoxy adhesive0.5 ~ 0.7 mils;
    Laminate structure: Single side & Double sides both available;

     

    Features & Applications:
    --Meet the RoHS requirement & halogen freeand pass SGS certificate.
    --Higher bond strengthgood dielectric properties
    --Excellent chemical and solvent resistancegood solder heating resistance.
    --Excellent dimensional stability.

     

    Widely used in the data communication, aerospacepersonal computer and automotive fields.

     

     

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    Add:Room 9B, Beijing Building, A6 Garden, Financial & Trading Zone, Haikou, Hainan, P.R.China:570125 Tel: (86-898)66729565 36667880 Fax: (86-898)66729560

    E-mail: sales@sinofuwang.com  technicalhnlscm

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